Announcing Artificial Chip Intelligence ACI™ Enterprise

Industry’s First Full-Stack Intelligence Infrastructure for Chip Design

Physics-informed foundational models.
Purpose-built for chip-design.

Grounded in semiconductor physics and trained on the industry’s largest dataset under governance for unparalleled accuracy, convergence, and cost-efficiency.

Built for all semiconductor workflows

From architecture exploration to tape-out, ACI adapts to every role on your team.

For logic designers

Evolve existing designs without starting from scratch.

Design repository ingestion
Incremental spec updates
Integrate IP modules
Estimate PPA & objectives
Learn more
For SoC architects

From requirements to optimized RTL in record time.

Import requirements
Explore architecture
Generate spec & plans
Generate RTL models
Learn more
For verification engineers

Automated verification from testplan to coverage closure.

Generate testplans
Generate UVM testbenches
Perform automated RCA
Fill coverage holes
Learn more
For implementation teams

Explore the PPA frontier with physics-informed optimization.

Estimate PPA pre-synthesis
Identify Pareto front
Explore architecture space
Recenter PPA corners
Learn more
For system engineers

Bridge the gap from RTL to a running system.

Generate FPGA prototypes
Transactors & host software
Testing & validation
System-level debug
Learn more

Forging the singularity

A new era of semiconductor design starts now. Cognichip’s ACI delivers silicon-ready results in hours — not months — fundamentally transforming how the world builds chips.

AGI meets chip design

Cognichip is an AI-first company revolutionizing the way semiconductors are designed.

Artificial Chip Intelligence ACI™ fundamentally reshapes the economics of chip design. It's built on the world's first physics-informed foundation AI model tailored for chip design.

Announcing our Series A funding

Join our team and take the journey with us

Cognichip at NYSE
Cognichip at NYSE
Cognichip at NYSE
Cognichip at NYSE

Cognichip's groundbreaking, physics-informed foundation model technology and proven leadership team position it to become a generational company.

— Lip-Bu Tan, CEO, Intel

Intel
Seligman Ventures
SBI Investment
Mayfield
Lux Capital
FPV Ventures
Candou Ventures
Forbes
— Just released —

Cognichip Creates Physics-Informed AI Models To Speed Chip Design

Unite.AI

Cognichip Raises $60M Series A to Rebuild Chip Design Around AI

Cognichip Series A

Seligman Ventures Leads Cognichip's $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures' Umesh Padval Join the Board

Don't miss what's next

Get early access to our latest developments and private betas